BERGQUIST® GAP PAD® TGP 1500
Poznat kao Gap Pad® 1500
Elementi i pogodnosti
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD® TGP 1500 is a silicone-based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Tehnički podaci
| Boja | Crna |
| Jangov modul, ASTM D575 | 310.0 KPa (45.0 psi ) |
| Radna temperatura | -60.0 - 200.0 °C |
| Standardna debljina | 0.508 - 5.08 mm |
| Toplotna provodljivost | 1.5 W/mK |
BERGQUIST® GAP PAD® TGP 1500
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.