LOCTITE® ECCOBOND FP4802
Connu sous le nom de FP4802 30CC SEMCO 50.4G -40CD
Caractéristiques et avantages
This black, high-purity encapsulant is designed for applications utilising lead-free solder. It’s suitable for protecting bare chips in a variety of advanced packages.
LOCTITE® ECCOBOND FP4802 is a black, high-purity liquid encapsulant specially designed for use in applications utilising lead-free solder. It was formulated to meet the non-halide objectives of many technical users and for temperature cycling ranges up to-65°C to 150°C (-40°F to 302°F). It features excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. It is ideal for bare-chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs), Plastic Ball Grid Arrays (PBGAs), and full arrays on Low Temperature co-fired Ceramic (LTCC).
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Informations techniques
| Coefficient de dilatation thermique (CDT), Above Tg | 100.0 ppm/°C |
| Coefficient de dilatation thermique (CDT), Below Tg | 20.0 ppm/°C |
| Température de stockage | -40.0 °C |
| Température de transition vitreuse | 50.0 °C |
| Teneur ionique extractible, Chlorure (Cl) | 5.0 ppm |
| Teneur ionique extractible, Potassium (K+) | 5.0 ppm |
| Teneur ionique extractible, Sodium (Na+) | 5.0 ppm |
| Viscosité, Brookfield - HBT, @ 25.0 °C Spindle 7, speed 10 rpm | 80000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4802
This black, high-purity encapsulant is designed for applications utilising lead-free solder. It’s suitable for protecting bare chips in a variety of advanced packages.